Chinese memory chip maker YMTC achieves design breakthrough despite US sanctions
中国存储芯片制造商YMTC在美国制裁下实现设计突破
China’s flash memory giant, Yangtze Memory Technologies Corp (YMTC), has made a small technology leap in its chip design architecture, thanks to closer ties with domestic chip tool providers, despite Washington’s efforts to slow the country’s semiconductor progress, according to a teardown report from Canadian research firm TechInsights.
加拿大研究公司TechInsights的一份拆解报告显示，尽管美国努力放缓中国在半导体领域的进展，但中国闪存巨头长江存储科技公司（YMTC）通过与国内芯片工具供应商建立更紧密的联系，在其芯片设计架构上取得了小幅技术进展。
A 512-Gb triple-level cell (TLC) memory chip, containing 160 active layers, was found inside a solid-state drive (SSD) under the name ZhiTai TiPlus, a consumer brand of YMTC. The chip adopted the latest design structure, called Xtacking4.0, according to TechInsights.
据TechInsights的报告，在名为致态TiPlus的固态硬盘（SSD）中发现了一颗512Gb的三层单元（TLC）存储芯片，包含160个活跃层。该芯片采用了最新的设计结构，称为Xtacking4.0。这款硬盘是长江存储（YMTC）的消费品牌。
